| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving wettability of an adhesive with respect to a circuit chip and preventing a pad formed on a substrate from being contaminated with the adhesive.SOLUTION: A substrate 20 includes: one surface 21; pads 26 formed on the one surface 21; and a first adhesion land 27 separated from the pads 26 and formed on the one surface 21 in a size equal to or larger than an adhesive plane 33 of a circuit chip 30. The substrate 20 also includes bleed preventive patterns 29 formed between the pads 26 and the first adhesion land 27. The circuit chip 30 is then fixed to the first adhesion land 27 by a first adhesive 50 which is wet and spread over the first adhesion land 27. The bleed preventive pattern 29 is provided between the first adhesion land 27 and the pads 26, such that movement of the first adhesive 50 bleeding from the first adhesion land 27 is blocked by the bleed preventive pattern 29. |
