| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device that can secure clearance for preventing two semiconductor chips mounted on a substrate from coming into contact with each other by the capillary phenomenon.SOLUTION: A substrate 20 has an L-shaped clearance securing pattern 27 for securing predetermined clearance between a circuit chip 30 and a sensor chip 40. The circuit chip 30 and the sensor chip 40 are arranged with the predetermined clearance on one surface 21 of the substrate 20 on the basis of the clearance securing pattern 27. Accordingly, even when adhesive agent 50 protrudes from the circuit chip 30 or adhesive agent 60 protrudes from the sensor chip 40, the clearance for preventing the circuit chip 30 and the sensor chip 40 mounted on the substrate 20 from coming into contact with each other due to the capillary phenomenon can be secured. |
