| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of suppressing occurrence of problems in the product, by suppressing the scattering of solder when raising a solder wire.SOLUTION: A solder supply method includes a step for coating a lead frame 5 with solder by bringing the tip of a solder wire 1, fed out from a solder nozzle 3, into contact with the upper surface of the lead frame 5 transported by a heater rail 4, a step for cutting the tip side of the solder wire 1 near the coated solder 1a, by means of a cutter 7 arranged on the outside of the solder nozzle 3, and a step for raising the solder wire 1 to the solder nozzle 3 side. |
