| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for input device apparatuses which is for input device apparatuses, low in average coefficient of linear thermal expansion and high in bendability.SOLUTION: In a substrate for input device apparatuses, glass cloth 2 is plain-woven and uses E glass, and a silane coupling agent is provided on the glass cloth 2. The substrate uses an aromatic glycidyl type epoxy compound consisting of a bisphenol type epoxy compound and has an average coefficient of linear thermal expansion of 0-40 ppm, a glass transition temperature of 130°C or higher and an elastic modulus at 250°C of 1 GPa or greater. |
