摘要 |
An erect type peeling device for a film attached to a printed circuit board according to the present invention has the effect of: preventing foreign substances which exist in the atmosphere and fall down or foreign substances falling down in a device from falling onto an upper surface of the printed circuit board and causing a fault by comprising a peeling part performing a peeling process at both sides at the same time after arranging the printed circuit board in an installation separation disc formed erectly in the inside thereof; significantly reducing the area of the peeling device compared to an existing peeling device which has performed the peeling process as laying and transporting the printed circuit board horizontally through a plurality of rollers or conveyors; and peeling the films attached to an upper surface and a lower surface of the printed circuit board at the same time by comprising the peeling part peeling the film attached to the printed circuit board at both sides across the installation separation disc. |