发明名称 |
JOINT MATERIAL AND JOINT METHOD USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a joint material easily printing on a material to be jointed and capable of suppressing generation of non-sintered part in a joint part of materials to be jointed, and to provide a joint method using the same.SOLUTION: A joint material consists of a silver paste containing a silver fine particle which is coated by an organic compound having 8 or less carbon atoms such as hexanoic acid and has an average primary particle diameter of 1 to 50 nm, a silver particle which is coated by an organic compound such as oleic acid and has the average primary particle diameter of 0.5 to 4 μm, a solvent consisting of a primary alcohol solvent and a terpene alcohol solvent and a dispersant consisting of a phosphorous ester-based dispersant (or the phosphorous ester-based dispersant and an acrylic resin-based dispersant) with the content of the silver fine particle of 5 to 30 mass%, the content of the silver particle of 60 to 90 mass%, the total content of the silver fine particle and the silver particle of 90 mass% or more and a monocarboxylic acid-based sintering assistant having an ether bond is added. |
申请公布号 |
JP2015225842(A) |
申请公布日期 |
2015.12.14 |
申请号 |
JP20140112212 |
申请日期 |
2014.05.30 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
ENDO KEIICHI;YUZAKI KOICHI;NAGAOKA MINAMI;MIYOSHI HIROMASA;KURITA TORU |
分类号 |
H01B1/22;B22F1/00;B22F1/02;B23K20/00;H01B1/00;H01B13/00 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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