GRINDING POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a grinding polishing device that polishes a circular plate-like work to a uniform thickness.SOLUTION: The grinding polishing device 1 includes: polishing means 3 for polishing the circular plate-like work; a dress mechanism 4 for dressing a polishing surface 36 of the polishing means; polish feeding means 37 for moving the polishing means close to or apart from a dressing surface 41 of the dress mechanism; and radial thickness measurement means for measuring thickness distribution in a radial direction of the circular plate-like work. The grinding polishing device adjusts a feed amount of the polish feeding means according to the thickness distribution measured by the radial thickness measurement means to form a surface that is polished according to the thickness of the circular plate-like work.