发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor laser capable of suppressing end surface breakage caused by catastrophic optical damage (COD) of a light emission end surface, and of having a high output characteristics.SOLUTION: Above an n-type substrate whose principal surface has an off angle from a (0001) plane in a <1-100> direction, an n-type clad layer NCLD, current block layers BL, an active layer, and a p-type clad layer are provided. For example, the current block layers BL are arranged on both sides of a current constriction region (a region 1A). In addition, the current block layers BL are arranged so as to be retreated from a cleavage plane (a line CL). In this case, in the active layer that has a quantum well structure crystal-grown above the n-type clad layer NCLD and the current block layer, a layer thickness in a window region WA from the cleavage plane (the line CL) to an end part of the current block layer BL becomes smaller than a layer thickness of the current constriction region (between the current block layers BL, the region 1A). As a result, a bandgap of the active layer in the window region WA becomes large, and end surface breakage caused by COD can be suppressed.
申请公布号 JP2015226045(A) 申请公布日期 2015.12.14
申请号 JP20140112268 申请日期 2014.05.30
申请人 RENESAS ELECTRONICS CORP 发明人 MIYASAKA FUMITO
分类号 H01S5/343;H01S5/323 主分类号 H01S5/343
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