| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipation structure of a SMD LED.SOLUTION: A heat dissipation structure of a SMD LED includes a substrate, at least one SMD LED, and at least one coupling member. A plurality of electrically and thermally conductive copper coils are provided on the upper end face of the substrate. Two positive and negative electrodes are provided on the bottom surface of the SMD LED, and bonded to two copper foils on the substrate. At least one coupling hole penetrates any one copper foil close to the SMD LED, and the upper and lower end faces of the substrate. The coupling member is composed of a metal material of high thermal conductivity, and when it is inserted into the coupling hole, the copper foil and substrate are connected. Since the heat generated from the SMD LED bonded to the copper foil is transmitted to the lower end face of the substrate via the coupling member, heat dissipation is promoted. |
