发明名称 Fabrication of a material with low expansion, e.g. a semiconductor substrate, involves casting an aluminum-silicon alloy into a mold filled with silicon carbide particles
摘要 Fabrication of a material with low expansion comprises filling a mold with particles of non-fired SiC and casting pure aluminum or an Al alloy containing Si in the mold at high pressure.
申请公布号 FR2843108(A1) 申请公布日期 2004.02.06
申请号 FR20030009156 申请日期 2003.07.25
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 SUGIYAMA TOMOHEI;KINOSHITA KYOICHI;YOSHIDA TAKASHI;KUDO HIDEHIRO;KONO EIJI
分类号 B22D19/14;C04B35/565;C04B35/653;C04B41/50;C04B41/51;C22C1/10;H01L21/48;H01L23/15;H01L23/373;(IPC1-7):C04B35/567;B28B1/14;B28B7/42 主分类号 B22D19/14
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