发明名称 |
Fabrication of a material with low expansion, e.g. a semiconductor substrate, involves casting an aluminum-silicon alloy into a mold filled with silicon carbide particles |
摘要 |
Fabrication of a material with low expansion comprises filling a mold with particles of non-fired SiC and casting pure aluminum or an Al alloy containing Si in the mold at high pressure.
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申请公布号 |
FR2843108(A1) |
申请公布日期 |
2004.02.06 |
申请号 |
FR20030009156 |
申请日期 |
2003.07.25 |
申请人 |
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI |
发明人 |
SUGIYAMA TOMOHEI;KINOSHITA KYOICHI;YOSHIDA TAKASHI;KUDO HIDEHIRO;KONO EIJI |
分类号 |
B22D19/14;C04B35/565;C04B35/653;C04B41/50;C04B41/51;C22C1/10;H01L21/48;H01L23/15;H01L23/373;(IPC1-7):C04B35/567;B28B1/14;B28B7/42 |
主分类号 |
B22D19/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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