发明名称 PEELING DEVICE, PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM
摘要 According to the present invention, a process of peeling off a substrate to be processed and a support substrate can be properly performed. A peeling device (141) of the present invention includes: a first holding/supporting unit (310) for holding and supporting a support substrate (S) among overlapped substrates (T); a second holding/supporting unit (420) for holding and supporting a substrate (W) to be processed among the overlapped substrates (T); and a moving unit (320) for moving the first holding/supporting unit (310) in a direction to be away from the second holding/supporting unit (420). The first holding/supporting unit (310) includes a plate-like elastic member (311) which is in contact with the moving unit (320), and a plurality of adsorbing units (312) which is installed on the elastic member (311) and adsorbs the support substrate (S). A first moving unit (330) of the moving unit (320) includes a support member (331), a moving mechanism (332), a support plate (333), and a rail (334).
申请公布号 KR20150139436(A) 申请公布日期 2015.12.11
申请号 KR20150071098 申请日期 2015.05.21
申请人 TOKYO ELECTRON LIMITED 发明人 HONDA MASARU;SAKAMOTO RYOICHI;IKEDA KATSUHIRO
分类号 H01L21/78;H01L21/677;H01L21/683 主分类号 H01L21/78
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