| 发明名称 |
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE |
| 摘要 |
The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a radiation-curable adhesive layer on a base material; and a film for flip chip type semiconductor back surface, which is provided on the radiation-curable adhesive layer, in which at least a part of the radiation-curable adhesive layer has been cured beforehand by irradiation with a radiation ray. |
| 申请公布号 |
KR20150138835(A) |
申请公布日期 |
2015.12.10 |
| 申请号 |
KR20150163192 |
申请日期 |
2015.11.20 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
TAKAMOTO NAOHIDE;SHIGA GOJI;ASAI FUMITERU;YAMAMOTO AKIYOSHI;TAKAHASHI TOMOKAZU |
| 分类号 |
H01L21/683;C09J7/02;H01L21/78;H01L23/495 |
主分类号 |
H01L21/683 |
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