| 摘要 |
FIELD: measurement equipment.SUBSTANCE: usage: to identify reasons for failures of a device or to assess quality of the process of production of the inner part of the electronic device. The substance of the invention consists in the fact that the method, in which they perform analysis of the electronic device sample by means of measurement of a certain property in several points of the specified sample, and they expose the specified several points before the analysis to at least one treatment, increasing the difference of the specified property, at least, in two elements of the electronic device sample, representing at least two layers of the layer package included into the electronic device, at the same time the specified treatment includes cutting of the layer package so that the difference is created in morphology of the cut surface at least between two of the specified layers of the package.EFFECT: provision of the possibility to facilitate survey of electronic device quality.4 cl, 1 dwg |
