COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME

摘要

Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.

主权项

1. A component-embedded board comprising:
a first board comprising a first insulation layer having a first face and a second face, a first conductive layer formed on the second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from the first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board comprising a second insulation layer having a first face, a second face, and an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of the first face and the second face of the second insulation layer, wherein the second conductive layer comprises a frame portion having a frame shape in a plan view, and wherein the opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.