| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-piece wiring board in which cracking and chipping are less likely to occur when dicing, and to provide a multi-piece wiring board which allows for formation of a wiring board having a shape other than square with rounded corners and square, after being diced.SOLUTION: A wiring board includes: a support substrate 1 formed by laminating an etchable metal foil 6 on the upper surface of a planar bottom plate 4, in a state where at least the central part can be peeled from the bottom plate 4; a frame 3 composed of an etchable plating metal layer applied on the metal foil 6 and having a plurality of openings 3a for partitioning the upper surface in the central part of the metal foil 6, into a plurality of product formation regions X arranged while spaced apart from each other; and a wiring board 2 including an insulation layer 7 deposited on each product formation region X so that the outer peripheral side face adheres to the inner wall of the opening 3a, and a wiring conductor 8 deposited on the insulation layer 7. |
