发明名称 |
LOW-AREA OVERHEAD CONNECTIVITY SOLUTIONS TO SIP MODULE |
摘要 |
Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer (120 ) for providing an interconnection between a system-in-a-package module comprising a first board (110), electronic components (130, 132) and a molded portion (140), and other components (150) in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components. |
申请公布号 |
WO2015187972(A1) |
申请公布日期 |
2015.12.10 |
申请号 |
WO2015US34233 |
申请日期 |
2015.06.04 |
申请人 |
APPLE INC. |
发明人 |
LEE, MENG CHI;PENNATHUR, SHANKAR;GOOCH, SCOTT, L.;PYPER, DENNIS, R.;SALEHI, AMIR |
分类号 |
H05K1/14;H05K3/28;H05K3/40 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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