发明名称 |
CAMERA HEAD, CONNECTING METHOD OF CAMERA HEAD AND ENDOSCOPE APPARATUS |
摘要 |
A camera head of an embodiment includes: a lens unit; a prism having an inclined surface which changes a traveling direction of light which passed the lens unit and an emission surface from which the light changed in traveling direction is emitted; an imaging element which outputs an electrical signal; a signal cable; a support member having a first surface having an inclination corresponding to the inclined surface and attached to a rear-side surface of the inclined surface, an insertion hole in which the signal cable is inserted, and a second surface having a connecting part electrically connected to the signal cable inserted in the insertion hole; and a wiring substrate having a first area where the imaging element is mounted and a second area electrically connected to the connecting part. |
申请公布号 |
US2015358519(A1) |
申请公布日期 |
2015.12.10 |
申请号 |
US201514593986 |
申请日期 |
2015.01.09 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Kamei Takatoshi |
分类号 |
H04N5/225;H04N7/10;G02B7/18;G02B13/00;G02B7/02 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
1. A camera head, comprising:
a lens configured to pass light; a prism having
an incident surface configured to receive the light passed through the lens,a light refraction part having an inclined surface configured to change a traveling direction of the light passed through the incident surface, andan emission surface configured to emit the light changed in traveling direction by the inclined surface; an imaging element to receive the light emitted from the emission surface and to output an electrical signal corresponding to the received light; a signal cable; a support member comprising
a first surface attached to a rear-side surface of the inclined surface, the first surface having an inclination corresponding to the inclined surface,an insertion hole receiving the signal cable inserted therein, anda second surface having a connecting part electrically connected to the signal cable inserted in the insertion hole; and a wiring substrate having a first area and a second area, the imaging element being mounted on the first area, the second area being electrically connected to the connecting part. |
地址 |
Tokyo JP |