| 发明名称 |
STRUCTURE AND METHOD FOR PACKAGE WARPAGE CONTROL |
| 摘要 |
Presented herein is a package comprising a molding compound layer and an active device in the molding compound layer. A conductive via passes through the molding compound layer and is adjacent to the active device. A passivation layer is disposed on the molding compound layer. An active PPI is disposed on the passivation layer and is electrically connected to the conductive via. A dummy PPI is disposed on the passivation layer and is electrically isolated from the conductive via and the active device. |
| 申请公布号 |
US2015357302(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201414298490 |
申请日期 |
2014.06.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Chen Ying-Ju;Chen Hsien-Wei |
| 分类号 |
H01L23/00;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a molding compound layer; an active device in the molding compound layer; a conductive via passing through the molding compound layer and adjacent to the active device; a passivation layer on the molding compound layer; an active PPI on the passivation layer and electrically connected to the conductive via; and a dummy PPI on the passivation layer and electrically isolated from the conductive via and the active device. |
| 地址 |
Hsin-Chu TW |
