| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A first conductive trace disposed on the substrate. A semiconductor die is disposed over the first conductive trace. A solder resist layer that extends across an edge of the semiconductor die is also included. Finally, a molding compound is provided that is formed over the substrate and covers the first conductive trace and the semiconductor die. |
| 申请公布号 |
US2015357291(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201514826471 |
申请日期 |
2015.08.14 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIN Tzu-Hung;HUANG Ching-Liou;GREGORICH Thomas Matthew |
| 分类号 |
H01L23/00;H01L23/31;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a substrate; a first conductive trace disposed on the substrate; a semiconductor die disposed over the first conductive trace; a solder resist layer, wherein a portion of the solder resist layer extends across an edge of the semiconductor die; and a molding compound forming over the substrate, covering the first conductive trace and the semiconductor die. |
| 地址 |
Hsin-Chu TW |
