INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

摘要

An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.

主权项

1. An integrated circuit (IC) package, comprising:
a first substrate having a backside surface and a top surface with a cavity disposed therein, the cavity having a floor defining a front side surface; a plurality of first electroconductive contacts disposed on the front side surface; a plurality of second electroconductive contacts disposed on the back side surface; a plurality of first electroconductive elements penetrating through the first substrate and coupling selected ones of the first and second electroconductive contacts to each other; a first die containing an IC electroconductively coupled to corresponding ones of the first electroconductive contacts; a second substrate having a bottom surface sealingly attached to the top surface of the first substrate; and a dielectric material disposed in the cavity and encapsulating the first die.