| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
The semiconductor device in accordance with one mode comprises a semiconductor chip; a chip mounting substrate on which the semiconductor chip is mounted; a chip container that is provided on the chip mounting substrate and contains the semiconductor chip; and a seal part that seals the chip container containing the semiconductor chip and the chip mounting substrate. The chip container has a frame part surrounding a periphery of the semiconductor chip. The height of the frame part is greater than that of the semiconductor chip. The inside of the frame part in the chip container is provided with a chip coating material that protects the semiconductor chip. |
| 申请公布号 |
US2015357271(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201514724556 |
申请日期 |
2015.05.28 |
| 申请人 |
Sumitomo Electric Industries, Ltd. |
发明人 |
FURUMAI Masaki |
| 分类号 |
H01L23/498;H01L23/367;H01L23/31;H01L23/047 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip; a chip mounting substrate on which the semiconductor chip is mounted; a chip container that is provided on the chip mounting substrate and that contains the semiconductor chip; and a seal part that seals the chip container containing the semiconductor chip and the chip mounting substrate; wherein the chip container has a frame part surrounding a periphery of the semiconductor chip; wherein a height of the frame part is greater than that of the semiconductor chip; and wherein the inside of the frame part in the chip container is provided with a chip coating material that protects the semiconductor chip. |
| 地址 |
Osaka-shi JP |
