发明名称 THIN FILM MATERIAL FOR PROCESSING USE
摘要 Provided is a plastic thin film material, on which a process material can be applied or deposited at low cost and with high efficiency, and in which an inorganic substance powder capable of achieving a functional processing for enabling the strong adhesion of a laminated layer on the thin film material is filled at a high density. A thin film material for processing use, which contains a thermoplastic resin and an inorganic substance powder at a weight ratio of 18:82 to 50:50, and has a specific gravity of 0.60 to 1.40 inclusive and a degree of absorption of water of 0.0 to 11.0 g/m2·120 sec inclusive as measured by a Cobb method in accordance with JIS P 8140.
申请公布号 US2015353695(A1) 申请公布日期 2015.12.10
申请号 US201314760576 申请日期 2013.12.27
申请人 TBM CO., LTD. 发明人 SUMI Yuichiro
分类号 C08J5/18;C09D129/04 主分类号 C08J5/18
代理机构 代理人
主权项 1. A thin film material for processing use, comprising a thermoplastic resin and an inorganic substance powder at a weight ratio of 18:82 to 50:50, wherein the thin film material for processing use has a specific gravity of 0.60 or more and 1.40 or less and a water absorptiveness as measured by a Cobb method in accordance with JIS P 8140 of 0.0 g/m2·120 sec. or more and 11.0 g/m2·120 sec. or less.
地址 Minato-ku, Tokyo JP