MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES

摘要

Described herein are techniques related to the efficient and effective manufacture electronic products (e.g., mobile devices, computers, etc.) that incorporate circuitry with semiconductor devices. As described herein, a new manufacturing approach incorporates unpackaged semiconductor devices (i.e., dies) into the circuitry of electronic products during manufacturing. This is done using a direct carrier-to-circuit die transfer approach. In addition, the dies and/or their related circuitry are packaged in-place (i.e., "in-situ packaging"). This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.