The present invention relates to a substrate processing apparatus which processes a substrate. The substrate processing apparatus includes: a chamber forming a space inside; a substrate support installed in the chamber and supporting the substrate inside the chamber; a process gas spraying unit disposed to face the substrate support on an upper side of the chamber and spraying process gas to the substrate; and a cleaning gas spraying unit connected to a side of the chamber and spraying cleaning gas into the chamber. The substrate processing apparatus and a cleaning method thereof can effectively remove a deposit by spraying the cleaning gas toward a region of which a deposit concentration level is high.
申请公布号
KR20150138469(A)
申请公布日期
2015.12.10
申请号
KR20140064957
申请日期
2014.05.29
申请人
CHARM ENGINEERING CO., LTD.
发明人
MIN, SUK KI;HAN, YOUNG KI;SEO, YOUNG SOO;LEE, JUN HYEOK