| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses occurrence of voids in underfil resin sealed between a semiconductor chip and an electronic component which are to be connected via bump electrodes. <P>SOLUTION: In the semiconductor device, a first semiconductor chip 10 and a second semiconductor chip 20 are so formed that bump formation faces of the individual chips may face each other. An opening 16 and 26 for pouring underfil resin between the first and second semiconductor chips 10 and 20 is formed near a bump formation region 12 and 22, at least in one of insulation films 14 and 24 which are protection films formed on the most outer surfaces of the first and second semiconductor chips 10 and 20, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT |
