| 发明名称 |
UNDERBUMP METAL FILM, SURFACE ACOUSTIC WAVE DEVICE USING SAME AND FORMING METHOD THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To form an underbump metal film provided with a thick nickel film required for tin diffusion prevention as a diffusion-resistant barrier layer by a vapor deposition lift-off method without using a special resist material, and to prevent separation of the underbump metal film due to an internal stress of the underbump metal film. <P>SOLUTION: In order to solve the above problem, the underbump metal film formed on an element substrate 11 by the vapor deposition lift-off. The configuration of the underbump metal film is provided with the diffusion resistant barrier layer 16 consisting of a metal film of platinum group and a stress relaxation layer 15 mainly containing an aluminum on its lower layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2006269458(A) |
申请公布日期 |
2006.10.05 |
| 申请号 |
JP20050080945 |
申请日期 |
2005.03.22 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
FURUKAWA MITSUHIRO;TAKANO ATSUSHI |
| 分类号 |
H01L21/60;H03H9/145;H03H9/25 |
主分类号 |
H01L21/60 |
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