发明名称 CURING METHOD AND CURING DEVICE OF PHOTOCURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curing method and/or a curing device of photocurable resin composition in which oxygen inhibition can be suppressed by a method different from conventional ones.SOLUTION: A curing method of a photocurable resin composition comprises: a first process of covering a photocurable resin composition (15) by liquid (20) into which the resin composition (15) is insoluble; and a second process of irradiating the resin composition (15) with light via the liquid (20) to cure the resin composition (15) after the first process, in which deoxidation treatment is performed to the liquid (20) before the first process.
申请公布号 JP2015221416(A) 申请公布日期 2015.12.10
申请号 JP20140106928 申请日期 2014.05.23
申请人 NICHIA CHEM IND LTD 发明人 MATSUSHITA TOSHIO
分类号 B05D3/06;B05C9/12;B05C11/10;H01L21/027 主分类号 B05D3/06
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