| 发明名称 |
PACKAGE AND METHOD FOR FABRICATING PACKAGE |
| 摘要 |
A package that hermetically seals an integrated circuit includes a metal lid 7 and a metal housing 10 having an open upper portion. In the package, the housing 10 includes in a wall surface thereof a glass unit 2 that seals a plurality of lead terminals therein. The glass unit 2 is disposed in a wall surface of the housing 10 such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit 2 is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit 2 and metal that forms the wall surface. |
| 申请公布号 |
US2015359121(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201514727049 |
申请日期 |
2015.06.01 |
| 申请人 |
NEC TOSHIBA Space Systems, Ltd. |
发明人 |
OUCHI Rieka;ISHII Yasuhiro;TANAKA Hideki |
| 分类号 |
H05K5/06;H01L21/48;H01L23/08;H01L23/047;H01L23/10 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package that hermetically seals an integrated circuit, the package comprising:
a metal housing having an open upper portion; and a metal lid, wherein the housing includes in a wall surface thereof a glass unit which seals a plurality of lead terminals therein, the glass unit is formed in the wall surface such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit and metal that forms the wall surface. |
| 地址 |
Tokyo JP |
