发明名称 PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND WIRING CONNECTION METHOD
摘要 A printed wiring board is provided with a wiring layer, a first ground layer, a second ground layer, a grounding through-hole, a signal through-hole, a first clearance, and a second clearance. The wiring layer has a signal line. The first ground layer has a first ground plane. The second ground layer is positioned between the wiring layer and the first ground layer and has a second ground plane. The grounding through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the second ground plane. The signal through-hole passes through the wiring layer, the first ground layer, and the second ground layer and is connected to the signal line. The first clearance is formed in the first ground layer, is positioned in the vicinity of the signal through-hole and the grounding through-hole, and separates the first ground plane from the signal through-hole and the grounding through-hole. The second clearance is formed in the second ground layer, is positioned in the vicinity of the signal through-hole, and separates the second ground plane from the signal through-hole.
申请公布号 US2015359084(A1) 申请公布日期 2015.12.10
申请号 US201414762321 申请日期 2014.01.08
申请人 NEC Corporation 发明人 KASHIWAKURA Kazuhiro
分类号 H05K1/02;H01P3/02;H05K3/42 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed wiring board comprising: a wiring layer including a signal wiring; a first ground layer including a first ground plane; a second ground layer positioned between the wiring layer and the first ground layer and including a second ground plane; a grounding through-hole penetrating the wiring layer and the first and second ground layers, and connecting the second ground plane; a signal through-hole penetrating the wiring layer and the first and second ground layers, and connecting the signal wiring; a first clearance formed in the first ground layer, positioned around the signal through-hole and the grounding through-hole, and separating the first ground plane from the signal through-hole and the grounding through-hole; and a second clearance formed in the second ground layer, positioned around the signal through-hole, and separating the second ground plane from the signal through-hole.
地址 Minato-ku, Tokyo JP