发明名称 SYSTEMS AND METHODS FOR FABRICATING VERTICAL-GATE-ALL-AROUND DEVICES
摘要 Structures and methods are provided for forming bottom source/drain contact regions for nanowire devices. A nanowire is formed on a substrate. The nanowire extends substantially vertically relative to the substrate and is disposed between a top source/drain region and a bottom source/drain region. A first dielectric material is formed on the bottom source/drain region. A second dielectric material is formed on the first dielectric material. A first etching process is performed to remove part of the first dielectric material and part of the second dielectric material to expose part of the bottom source/drain region. A second etching process is performed to remove part of the first dielectric material under the second dielectric material to further expose the bottom source/drain region. A first metal-containing material is formed on the exposed bottom source/drain region. Annealing is performed to form a bottom contact region.
申请公布号 US2015357432(A1) 申请公布日期 2015.12.10
申请号 US201414295388 申请日期 2014.06.04
申请人 Taiwan Semiconductor Manufacturing Company Limited 发明人 LIN CHENG-TUNG;TSAI TENG-CHUN;WANG LI-TING;CHEN DE-FANG;PENG CHIH-TANG;LIN HUNG-TA;WANG CHIEN-HSUN;HUANG HUANG-YI
分类号 H01L29/66;H01L27/092;H01L21/8238;H01L29/775 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method for fabricating nanowire devices on a substrate, the method comprising: forming a nanowire on a substrate, the nanowire extending substantially vertically relative to the substrate and being disposed between a top source/drain region and a bottom source/drain region; forming a first dielectric material layer on the bottom source/drain region; forming a second dielectric material layer on the first dielectric material layer; performing a first etching process to remove part of the first dielectric material layer and part of the second dielectric material layer to expose part of the bottom source/drain region; performing a second etching process to remove part of the first dielectric material layer under the second dielectric material layer to further expose the bottom source/drain region; forming a first metal-containing material on the exposed bottom source/drain region; and performing annealing on the first metal-containing material and the bottom source/drain region to form a bottom contact region.
地址 Hsinchu TW