| 摘要 |
The present invention relates to a stack package, especially, to a technology which blocks a current path in a standby state of a multi-stack chip to reduce standby currents. The stack package comprises: a plurality of chips each stacked with a plurality of layers; and a plurality of pads respectively formed on the chips. Each chip comprises: a ground path unit configured to form a current path between a pad and a ground stage; a selection unit configured to selectively control a connection path coupled to the pad according to a chip enable signal; and a controller configured to selectively control a connection between the selection unit and the ground path unit according to a control signal. |
