LIGHT EMITTING DEVICE PACKAGE MODULE, BACKLIGHT UNIT, LIGHTING DEVICE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to a light emitting device package module, a backlight unit, a lighting device, and a method for manufacturing a light emitting device package module. The light emitting device package module includes: a substrate; an upper electrode layer which is formed on the upper surface of the substrate, includes a second electrode layer and a first electrode layer having an electrode separation space, and has a reflective surface; a light emitting device package which is mounted on a mounting surface installed on each of the first and second electrode layers to be electrically connected to the first and second electrode layers respectively; and a light-transmitting protection layer which is installed on at least a part of the first and second electrode layers except the mounting surface to protect the first and second electrode layers, and is made of a light-transmitting material to enable the light generated by the light emitting device package to pass through to be reflected by the first and second electrode layers.