| 摘要 |
Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from atop surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate. |
| 主权项 |
1. A flexible circuit board, comprising:
a first carrier board, which comprises: a first thick copper layer, a first thin copper layer, which has a top surface and a bottom surface, and a first release layer, which is formed between the first thick copper layer and the top surface of the first thin copper layer; a flexible circuit substrate, which has a first surface and a second surface and the first surface of the flexible circuit substrate is bonded by a first adhesive layer to the bottom surface of the first thin copper layer of the first carrier board and the second surface of the flexible circuit substrate comprises a bottom copper layer formed thereon; at least one through hole having a hole wall surface, which is formed through the first thick copper layer, the first release layer, the first thin copper layer, the first adhesive layer, the flexible circuit substrate, and the bottom copper layer; and a first electroplating layer, which is formed on a top surface of the first thick copper layer, the hole wall surface, and a bottom surface of the bottom copper layer. |
