| 摘要 |
PROBLEM TO BE SOLVED: To reduce noise of a semiconductor device having a power module.SOLUTION: A semiconductor device 1 having a structure where a power module 2 is provided on a cooler 4 via an insulation layer 3 comprises an inductor 5 provided between the power module 2 and the cooler 4 in parallel with the insulation layer 3. Capacitance of the insulation layer 3 and a frequency of the LC resonance circuit are controlled in a manner such that a frequency of an LC resonance circuit formed by the insulation layer 3 and the inductor 5 becomes a frequency to reduce noise generated in the power module 2. |
