发明名称 MEMS and Method for Forming the Same
摘要 A method and apparatus are provided to prevent or reduce stiction of a MEMS device. The MEMS device may include a protrusion extending from a surface of the MEMS device. During manufacture, the protrusion may be connected across an opening in the MEMS device to a sidewall of the substrate. Before manufacture of the MEMS device is completed, at least a portion of the protrusion connecting the MEMS device to the substrate may be removed. During operation, the protrusion may provide stiction prevention or reduction for the surface from which the first protrusion may extend. A plurality of protrusions may be formed along a plurality of surfaces for the MEMS device to prevent or reduce stiction along the corresponding surfaces. Protrusions may also be formed on devices surrounding or encapsulating the MEMS device to prevent or reduce stiction of the MEMS device to the surrounding or encapsulating devices.
申请公布号 US2015353342(A1) 申请公布日期 2015.12.10
申请号 US201313860759 申请日期 2013.04.11
申请人 Ltd. Taiwan Semiconductor Manufacturing Company, 发明人 Chang Kuei-Sung;Wu Ting-Hau
分类号 B81B3/00;B81C1/00 主分类号 B81B3/00
代理机构 代理人
主权项 1. A method comprising: forming a MEMS device in a first substrate, the MEMS device having a first surface; forming a first protrusion in a first opening of the MEMS device to extend from the first surface of the MEMS device across the first opening to connect to a sidewall of the substrate adjacent to the MEMS device; bonding the first substrate to a second substrate, the second substrate having a first surface; and removing at least a portion of the first protrusion following the bonding the first substrate to the second substrate.
地址 US
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