A Package of Microstructure and a Method for Fabricating the Same,申请号KR20050043349-传众专利搜索

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发明名称	A Package of Microstructure and a Method for Fabricating the Same
摘要
申请公布号	KR100674143(B1)	申请公布日期	2007.01.29
申请号	KR20050043349	申请日期	2005.05.23
申请人		发明人
分类号	H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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