| 摘要 |
The invention relates to an integrated circuit cooling array, preferably for a microprocessor or cooling apparatus, consisting of a dielectric substrate with doped and distinguished areas for the realization of at least one microelectronic component forming an integrated circuit, and at least one thermoelectric component forming a cooling array. The cooling array is characterized in that the thermoelectric component 1 comprises at least one first contact area, at least one second contact area and at least one cooling section whereat the cooling section is arranged between the first and the second contact area and consists of at least one thermal element 29, which is supplied with voltage by the first contact area and the second contact area through a control unit, whereat the thermal element 29 consists of at least one doped layer and a second doped layer, which are in such a way connected by a bridge element 53, 58, 59, 73, 83, 84, 92 that the bridge element 53, 58, 59, 73, 83, 84, 92 rests only partially on the first doped layer and/or the second doped layer. By means of the cooling array according to the invention compact and/or more efficient integrated circuits may be realized, since a sufficiently free heat flow from the inside of the integrated circuit is guaranteed. |
