| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve connection reliability of an electrode pad composed of an aluminum-containing metallic material and a bonding wire composed of copper.SOLUTION: A semiconductor device comprises: a semiconductor substrate 16E; wiring 26E-28E formed on the semiconductor substrate 16E; insulation layers 17E-19E which cover the wiring 26E-28E; barrier layers 23E-25E formed on the insulation layers 17E-19E; an electrode pad 9E formed on the barrier layers 23E-25E at a position opposite to part of the wiring; and a bonding wire 5E which is composed of copper and bonded to the electrode pad. In plan view, an area of the wiring overlapping a bonded region of the bonding wire 5E and the electrode pad 9E is equal to or less than 26.8% of an area of the bonded region. |
