MOUNTING STRUCTURE AND METHOD FOR DISSIPATING HEAT FROM A COMPUTER EXPANSION CARD

摘要

A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.

主权项

1. A mounting structure configured for mounting an expansion card within a computer enclosure and for absorbing and conducting heat from a heat source on the expansion card to an ambient atmosphere surrounding the enclosure, the mounting structure comprising:
a mounting bracket configured to support the expansion card within the computer enclosure; means for securing the mounting bracket to the enclosure; a heat sink adapted to contact a surface of the heat source on the expansion card; an extension interconnecting the heat sink and the mounting bracket; means for conducting heat from the heat sink to the mounting bracket; and means associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding an exterior of the enclosure by a phase change medium within the mounting structure.