WAFER LEVEL PACKAGE AND A FABRICATING METHOD THEREOF

摘要

A wafer level package and its manufacturing method are provided to increase wall illumination and to have a vertical shape of a hole by manufacturing a through-hole using photoresist. A pillar is formed on an upper substrate(300). A seed layer is deposited on a lower substrate(310). A photoresist(320) is applied to the seed layer. An MEMS(Micro Electrical Mechanical System) structure(350) is mounted on the photoresist. A junction unit(340) couples the upper substrate to the lower substrate. The upper substrate and the lower substrate is one of glass, ceramic, and silicon. The photoresist includes a pillar(330) on an upper portion thereof. Plural through holes are formed on the photoresist. A metal line is formed in a through-hole(360).