| 摘要 |
The present invention relates to an injection molding device using a liquid epoxy resin. The injection molding device using a liquid epoxy resin comprises: a dosing unit in which a liquid epoxy resin and raw materials including a curing agent are stored, and pumping and discharging the stored raw material at high pressure; a processing unit which includes a mixing block which primarily mixes the raw materials supplied from the dosing unit, an additive supply unit which adds an additive to the primarily mixed mixture, an additive tank in which the additive is stored, a raw material mixing unit which secondarily mixes the primary mixture with the additive, and a resin injection valve which quantitatively supplies the molten resin generated by the secondarily mixing; and a resin injection valve which receives the secondarily mixed molten resin from the raw material mixing unit, and quantitatively supplies the molten resin toward the mold. |
