Clearance inspection apparatus and clearance inspection method

摘要

A clearance inspection apparatus for inspecting clearance of a wiring line passing between vias on a substrate comprises: first determining means for determining vias adjacent on both sides of a reference via as first adjacent vias, the reference via and the first adjacent vias belonging to a first via row, wherein the reference via serves as a reference in clearance inspection; second determining means for determining vias adjacent to the first adjacent vias as second adjacent vias, the second adjacent vias belonging to a second via row which is adjacent to the first via row; and third determining means for determining a via located between the second adjacent vias as an inspection target via, wherein the clearance inspection apparatus inspects the clearance of the wiring line passing between the reference via and the inspection target via.