| 摘要 |
PROBLEM TO BE SOLVED: To provide a WLP (Wafer Level Package) type acoustic wave device in which a problem caused by a member disposed on a top face of a cover is unlikely to occur, and which is adaptive to downsizing, and a method of manufacturing the same.SOLUTION: An acoustic wave device includes: a substrate 3 for acoustic wave propagation; an excitation electrode 2 disposed on a principal surface of the substrate and for acoustic wave generation; and a cover 5 disposed on the principal surface of the substrate and for protecting the excitation electrode. The cover includes: a first principal surface 5a which is a surface at a side of the principal surface of the substrate; and a second principal surface 5b which is a surface at a side opposite to the first principal surface 5a. The first principal surface includes an outer peripheral edge located inside an outer peripheral edge 13 of the principal surface of the substrate 3, and the second principal surface includes an expansion region of which an outer peripheral edge is located outside the outer peripheral edge of the first principal surface. Thus, while an entire structure adapts to downsizing, a space for disposing a terminal for electrically connecting the excitation electrode to an external circuit or a reinforcing layer to be formed in the cover as a reinforcing member for preventing deformation of a vibration space of the excitation electrode can be secured on the second principal surface of the cover. |
