| 发明名称 |
METHOD OF HEAT TRANSFER IN POWER ELECTRONICS APPLICATIONS |
| 摘要 |
An exemplary method of heat transfer in power electronics applications is disclosed, wherein a metal foil including at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The metal foil is disposed on a heat sink. A base plate of a heat generating component or module is disposed on the heat sink covered by the metal foil to provide a power electronics device. A clamping force is applied to the power electronics assembly to provide a cooled power electronics assembly. |
| 申请公布号 |
US2015359143(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201514734437 |
申请日期 |
2015.06.09 |
| 申请人 |
ABB Technology Oy |
发明人 |
SILVENNOINEN Mika;MARTINMAA Juha;MÖRSKY Heikki |
| 分类号 |
H05K7/20;B23P15/26 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of heat transfer in power electronics applications, comprising:
a metal foil including at least about 50% of tin that is based on a total amount of metals contained in the metal foil, the metal foil is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. |
| 地址 |
Helsinki FI |
