ELECTROPHOTOGRAPHIC DEPOSITION OF UNPACKAGED SEMICONDUCTOR DEVICE

摘要

Described herein are techniques related a precision deposition of unpackaged semiconductor devices (“dies”) onto a substrate. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

主权项

1. A method of electrophotographic deposition of unpackaged semiconductor devices (“dies”), the method comprising:
writing a latent image on a photosensitive drum, wherein the latent image includes a pre-configured outline of die placements that will be deposited onto a substrate; providing a developing unit filled with ferromagnetic dies; aligning the ferromagnetic dies in the developing unit to conform with the latent image on the photosensitive drum, wherein the aligning includes a controlled application of an electro-magnetic (EM) polarization to affect a physical orientation of each ferromagnetic die; configuring the photosensitive drum to include an electro-static charge; transferring the aligned ferromagnetic dies from the developing unit to the photosensitive drum; depositing the ferromagnetic dies onto the substrate.