| 摘要 |
A land grid array (LGA) module, comprising: an LGA module main body (11), and a plurality of welding ends (102) arranged on a lower surface of the LGA module main body (11), wherein a plurality of through holes (101) are also arranged at a position in the LGA module main body (11) corresponding to each welding end (102), an upper opening of each of the through holes (101) is arranged on the upper surface of the LGA module main body (11), a lower opening is arranged on the lower surface of the LGA module main body (11), and the lower opening is covered by a welding end (102) at a corresponding position. The land grid array (LGA) module overcomes the problem in the prior art that the false welding and insufficient solder appearing at the junction of the welding ends on the lower surface of the module main body and a single board cannot be detected; and moreover, maintenance can be conducted without taking the LGA module main body off the single board. |
