A METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE

摘要

A method of manufacturing a light emitting device package according to an embodiment of the present invention includes a step of forming a light emitting structure which includes a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate; a step of forming a first electrode and a second electrode which are respectively connected to the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer on the light emitting structure; a step of forming a first bonding layer on the light emitting structure; a step of polishing the first bonding layer; a step of forming a second bonding layer on the polished first bonding layer; and a step of bonding the light emitting structure onto a support substrate by using the first bonding layer and the second bonding layer.