| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic probe which can suppress multiple reflection for a phenomenon in which suppression effects of multiple reflection differ from each other due to the plate thickness of a semiconductor substrate even though the acoustic impedance of a backing layer is made to match the semiconductor substrate of a CMUT cell.SOLUTION: In an ultrasonic probe which comprises a semiconductor substrate 1 in which a plurality of CMUT cells are formed on the surface thereof, an acoustic lens 3 provided on the surface side of the CMUT cell, and a backing layer 5 provided on the rear surface side of the semiconductor substrate 1, the backing layer 5 is formed of a first backing layer 27 brought into contact with the semiconductor substrate and a second backing layer 29 provided on the rear surface side of the backing layer 27, the backing layer 27 has acoustic impedance set on the basis of the plate thickness of the semiconductor substrate 1, the backing layer 29 is formed of attenuation material capable of attenuating an ultrasonic wave penetrating the backing layer 27, and the acoustic impedance is set in accordance with the acoustic impedance of the backing layer 27 to suppress multiple reflection of a reflection echo. |
