The present invention relates to an apparatus for processing a substrate. According to one embodiment of the present invention, the apparatus for processing a substrate includes: a container having a processing space inside; a substrate support unit located inside the container and supporting a substrate; and a spraying member spraying a processing solution onto the substrate placed on the substrate support unit. Veining is formed on an inner side of the container.
申请公布号
KR20150138544(A)
申请公布日期
2015.12.10
申请号
KR20140065389
申请日期
2014.05.29
申请人
SEMES CO., LTD.;SAMSUNG ELECTRONICS CO., LTD.
发明人
SONG, GIL HUN;CHOI, KI RYONG;CHOI, YOUNG CHOL;PARK, GUI SU;PARK, SUN YONG