| 发明名称 |
FLEXIBLE SUBSTRATE |
| 摘要 |
A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer. |
| 申请公布号 |
US2015359085(A1) |
申请公布日期 |
2015.12.10 |
| 申请号 |
US201414317254 |
申请日期 |
2014.06.27 |
| 申请人 |
CHIPBOND TECHNOLOGY CORPORATION |
发明人 |
Chen Yi-Wen;Lin Yin-Chen;Ke Ming-Hsiao;Ma Yu-Chen |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible substrate includes:
a base layer having a first surface and a second surface opposite to the first surface; a metallic layer formed on the first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block for defining marked position; a solder mask layer, wherein the solder mask layer is a material that is pervious to light and comprises an exposing surface, the traces and the at least one bottom block are covered with the solder mask layer, wherein a pre-marked area is defined on the exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, the pre-marked area is located above the perpendicular direction of the at least one bottom block of the metallic layer, and the range of the pre-marked area is defined by projection of the outlined edge of the at least one bottom block; and an identifying code formed within the pre-marked area of the solder mask layer. |
| 地址 |
Hsinchu TW |
